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Gross TS, Prindle CM, Chamberlin K, et al. Two-dimensional, electrostatic finite element study of tip-substrate interactions in electric force microscopy of high density interconnect structures. Ultramicroscopy. 2001;87(3):147-54doi: 10.1016/s0304-3991(00)00093-0.
Gross, T. S., Prindle, C. M., Chamberlin, K., bin Kamsah, N., & Wu, Y. (2001). Two-dimensional, electrostatic finite element study of tip-substrate interactions in electric force microscopy of high density interconnect structures. Ultramicroscopy, 87(3), 147-54. https://doi.org/10.1016/s0304-3991(00)00093-0
Gross, T S, et al. "Two-dimensional, electrostatic finite element study of tip-substrate interactions in electric force microscopy of high density interconnect structures." Ultramicroscopy vol. 87,3 (2001): 147-54. doi: https://doi.org/10.1016/s0304-3991(00)00093-0
Gross TS, Prindle CM, Chamberlin K, bin Kamsah N, Wu Y. Two-dimensional, electrostatic finite element study of tip-substrate interactions in electric force microscopy of high density interconnect structures. Ultramicroscopy. 2001 Apr;87(3):147-54. doi: 10.1016/s0304-3991(00)00093-0. PMID: 11330501.
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